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Our advanced devices support downsizing, thinning and high performance of application products.

Our original precision processing and packaging technology cultivated through wrist watch manufacturing started the process. By regarding them as our core technology, we have further constructed high level technologies such as precision molding, precision dies, optical design and collective substrate fabrication. All products are applicable for the SDM (Surface Mount Device) type. Automated mounting considerably contributes to cost reduction. We have the world's top share in production quantity thanks to our compact, high-quality and high-performance package lineup.

COB Series Version6



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